Sensor technology often requires an enclosure to ensure that the electronics stay protected. I was tasked with the development of low cost (rapid-prototyped) and large scale production (injection molded) enclosures. The first series of enclosures were designed to enclose a pre-existing sensor, while later developments where parameterized to fit rectangular boards.
A couple of the parametric designs: Design 1 is designed to be strapped to a surface; Design 2 is designed to be attached via carabiner.